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About Contact Materials

Superior assembly and packaging technology
Heraeus is a family-owned, global company active in the business areas of precious metals, sensors, dental and medical products, quartz glass and specialty lighting sources. Heraeus has been one of the leading companies in precious metals and materials technology for more than 155 years.
The Heraeus Contact Materials Division is a part of Heraeus Materials Technology.
For more than 20 years the Contact Materials Division with its two Business Units Bonding Wires and Assembly Materials has been the leading manufacturer of materials for assembly and packaging technology in the electronics industry.
Contact Materials Division offers a wide product range for various applications of:
  • Automotive industry
  • Telecommunications
  • Semiconductor manufacturers
  • Consumer goods industry
Bonding Wires
Bonding Wires
The Business Unit Bonding Wires produces bonding wires, bonding ribbons and solder foils.
The increasing miniaturization in electronics has resulted in bonding wires becoming important constituents of the electronics industry.
Bonding wires of gold, aluminum, copper and palladium are used for the electrically conducting connection from the connection pad to the system carrier. For this purpose fine and ultrafine wires are used. Highest demands are made on their quality, especially with regard to the uniformity of the wire properties.
Depending on their chemical composition and specific properties, the bonding wires are adapted to the bonding technique selected and to automatic bonding machines as well as to the various production conditions.
Products:
  • Bonding wires for applications in plastic filled electronic components
  • Aluminum and aluminum alloy bonding wires for applications which require a low processing temperature
  • Copper bonding wires as a technical and economical alternative to gold wires
  • Precious and non-precious metal bonding ribbons for electrical connections with large contact areas
  • Solder foils of high purity gold alloys for fixing chips to the carrier
Please find more information about the Business Unit Bonding Wires:
Microbond Assembly Materials
Microbond Assembly Materials
For more than two decades the Heraeus Contact Materials Division has been the leading manufacturer of materials for packaging technology in the global electronics industry.
The main focal points of the Business Unit Microbond Assembly Materials are in demanding applications for automobile and consumer electronics and in semiconductor and packaging applications.
The most important criteria in selecting materials are the highest possible quality and process stability.
Products:
  • Printable lead-free and lead-containing solder pastes
  • Sinterpastes
  • Dispensable solder pastes
  • Wafer bumping and ultra-fine pitch solder pastes
  • Solder powder type 6-8 (Welco®)
  • Solder balls
  • Solder wires
  • Conductive and non-conductive adhesives
  • SMT adhesives
  • Fluxes