From the Melting of Precious Metals to Micro-Joining Technology
Electrically conducting connections have to be manufactured for integrated and highly integrated circuits to join the connection pad of the chip to the system carrier of the semiconductor component.
Fine and ultra-fine wires of precisely doped and alloyed metals having diameters ranging from 8 µm to 500 µm are used for this purpose. Highest demands are made on the reliability and quality of these bonding wire connections.
The experience of decades, the high technical competence and the continual integration of the wide ariety of customer requirements into our production expertise guarantee the high quality of Heraeus products.
Worldwide activities and an intensive interchange of technology and information between our production sites throughout the world permit optimum supplies and best possible prompt service.
Heraeus established bonding wire production in the early 1970s at the headquarters in Hanau, Germany. For more than 25 years bonding wires made by Heraeus have been available in Korea. Between 1992 and 2002 production sites were set up in China and the Philippines. With this strategic decision Heraeus was able to offer its excellent service and technological advances to the local customers.
With the acquisition of the bonding wire business of Kulicke & Soffa Inc. Heraeus subsequently combined its own knowledge with over 40 years experience from the companies formerly known as “Mueller Feindraht AG” and “American Fine Wire”. Today Heraeus is a leading provider of technological solutions for gold, aluminum and copper bonding wire, serving our customers locally with a global perspective.
