Heraeus Stud Bumping Bonding Wires
Heraeus Gold Stud Bumping Wires provide versatility for all types of bumping applications including standard stud, coined, and stacked bumps. Available in either 2N or 4N compositions, it delivers consistent bump height and long-term bond stability.
|
Stud Bumping Gold Wire Selection Matrix
|
|
Attribute
|
4N (99.99% Au)
|
2N (99% Au)
|
Tail Height
|
Low
|
Low
|
|
Tail Consistency
|
Excellent
|
Excellent
|
|
Bondability
|
Excellent
|
Good
|
|
Shear Strength Level
|
High
|
Higher
|
|
Sensitive Pad Applications
|
Excellent
|
Good
|
|
Long Term Bond Stability
|
Good
|
Good
|
|
Use as Conventional Ball Bonding Wire
|
Yes
|
No
|
|
Conductivity (µOhm cm)
|
2.3
|
3.2
|
