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Copper Bonding Wires

Characteristics

  • High conductivity
  • High tensile strength with high elongation
  • Good loop stability
  • Significantly reduced formation of intermetallic phases
  • Very good ball formation under protective gas
Areas of application
  • Discrete components
  • Semiconductor components
Copper Wire Typical Dimensions and Standard Mechanical Specifications
Diameter Elongation (%) Breaking Load (cN)
µm mils
20 0.8 8 - 16 5 - 10
25 1.0 8 - 16 8 - 15
28 1.1 10 - 20 10 - 20
30 1.2 10 - 20 12 - 22
38 1.5 10 - 20 20 - 30
50 2.0 15 - 25 40 - 55
65 2.5 15 - 25 60 - 80
75 3.0 15 - 30 80 - 120

Copper Wire Cost Savings

The relatively low cost of copper is one of the reasons for its appeal as an alternative interconnect material. By replacing gold wires with copper material, thus replacing the precious metal part, significant cost savings are possible.
In applications that require increased wire diameters, the usage of copper bears a disproportionately high impact on the saving effect.

Superior Performance of Copper Wires

Copper exhibits significantly better conductivity than gold or aluminum. Therefore better heat dissipation and increased power ratings are attainable with thinner wire diameters. Copper possesses higher mechanical properties compared to gold. Therefore it displays excellent ball neck strength and high loop stability during molding or encapsulation.

Slower Intermetallic Growth for Increased Reliability

Intermetallic growth in copper bonds is significantly slower than in gold wire bonds. This results in lower electrical resistance, lower heat generation and, ultimately, increased bond reliability and device performance. The reduced rate of intermetallic growth, lower resistance and lower heat generation in copper wires in comparison with gold wire result in a lower increase in resistance over time and slower aging.