Heraeus no clean fluxes are available for a wide range of applications including rework, BGA/CSP ball attach, Flip chip attach and wave soldering. These fluxes are offered in liquid, paste or gel forms depending on application and deposit technique. Heraeus fluxes may be applied using several methods which include spraying, foaming, dipping, pin transfer, printing, and dispensing. These residues of these fluxes do not require cleaning and meet J-STD-004 requirements. Additionally, fluxes are available in halogen free and ultra low residue versions for demanding applications. Heraeus no clean fluxes are also available in VOC options for wave soldering applications.
