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Sinter Pastes

Sinter Pastes
mAgic Sinter Pastes are most suitable for building leadfree connections in the electronics. High reliable connections can be constructed at processing temperatures from 220-280°C as well as at much more higher temperatures. Besides that highest electrical and thermal conductivity can be offered.
Application Field:
DCB-Applications, Thyristores, Leadframe, LED
Comparison mAgic Sinter Technology vs. Convential Materials
Property mAgic Sinter Paste High Lead Solder SnAg3.5
Electrical conductivity
10.5-40 MS/m 4.8 MS/m 7.8 MS/m
Thermal conductivity
 >100 W/(m*K) 25 W/(m*K) 70 W/(m*K)
CTE
 19 ppm/K 29 ppm/K 28 ppm/K
Melting Point
 961°C <300°C 221°C
Homologous temperature
(operation temperature 175°C) 		36% 78% 91%
Process temperature 230°C >300°C 250°C
Shear strength @ 25°C
 20 MPa 15 MPa 20 MPa
Shear strength @ 300°C
 10 MPa n/a n/a
Tensile strength @ 25°C 55 MPa 29 MPa 30 MPa

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