Heraeus offers a full line of no clean, solvent clean, and water soluble solder pastes for surface mount and semiconductor applications. Sn/Pb and Sn/Pb/Ag alloys are available in melting points from 179 °C to 312 °C. These pastes are compatible with a variety of reflow methods including convection, vapor phase, and vacuum systems. Solder pastes are available in particle sizes ranging from Type 3 to Type 8 powders for standard and ultrafine printing requirements. Dispensable versions are also available for air over and positive displacement systems. Heraeus Pb containing solders are also available in halogen free versions which meet the most demanding applications e. g. thin Au wire bonding.
