Based on more than 20 years experience in solderpaste manufacturing, Heraeus has developed special bumping solder pastes for various printing applications. The capabilities are ranging from dry film (licensed by FCI) to stencil processes. The created bumps are connecting high end CPU’s and Flip chip substrates with large numbers of IO’s and ultra fine pitches.
Heraeus has expertise in supplying pastes with fine solder powders that enable pitches down to 40 μm, whereas the printing process represents a more cost effective and flexible bumping method compared to conventional sputtered or plated methods. These pastes are available in SAC and tin / lead alloys, with particle sizes of Type 5, 6, 7 and 8.
