Bonding wires and substrates for the electronic industry have been part of the Heraeus product lineup for many years. A series of bonding systems and testing devices are available for optimization and continuous quality control of these products for a wide variety of wires (Au, Al, AlSi, Cu, Ø = 15 µm - 600 µm), strips and substrates. We also offer bonding of small series, e.g. for pilot production runs.
In addition, our lineup includes aging of electric contacts, connection elements, components and assemblies in single and multi-component corrosive gas climates, as well as condensation water and salt-fog aging. Temperature change tests and pressure cooker tests round out the options.
We can determine electrical and physical properties, such as conductivity, capacity, inductivity, breakdown voltage or temperature coefficients or perform leak tests on housings.
